Backend Equipment

• Backgrind, Slicing,Lapping,Polishing
• Ball Placement,Attach
• Base Loader
• Bumping,3D Interconnect Aligners
• Cleaning,Washing
• Cut & Down Set,Trim
• Deflashing,Degating
• Feeding,Device Handling
• Dicing, Sawing,Scribing,Separation
• Die Bonding
• Die Removal
• Die Sorter, Pick & Place, Flip Chip Placement 
• Dispensing
• Hot Embossing
• Lead Finishing,Straightening
• Lead Frame Taping
• Marking, Imprinting,Labeling
• Molding, Encapsulation, Decapsulation
• Package Handling, Conveying
• Plating,Electro Chemical Plating
• Screen, Alignment , Film
• PROM,Memory Programmer 
• Solder Reflow, Soldering,Brazing
• Tape Auto, Bonding (TAB),Bumped TAB (BTAB)
• Wafer Level Bonders
• Wafer Mount, Taping
• Wire Bonding