Frontend Equipment

• Asher, Descum Clean-Plasma, Dry
• Asher, Descum Clean-Wet
• Bumping
• Chemical Mechanical Polishing-CMP
• Coat Develop Track Resist Processing
• Crystal Growing & Machining
• Deposition ALD
• Deposition CVD
• Deposition Evaporator Equipment
• Deposition LPCVD
• Deposition PECVD
• Deposition Plating Electro Chemical Plating
• Deposition Sputtering Equipment
• Deposition Others
• Epitaxy
• Etcher-Aanisotropic, RIE ICP DRIE Bosch process
• Etcher-Isotropic,Plasma,Dry
• Etcher-Isotropic,Wet
• Ion E-Beam Milling Etching
• Ion Implantation
• Lithography Exposure Mask Aligner
• Minienvironments, Environmental Enclosures
• SOI Bonders; Temporary Bonders; De-Bonders
• Spin on Glass (SOG); on Dielectric (SOD) Track
• Thermal Processing:Furnace,Oven and Other
• Thermal Processing:Rapid Thermal Processing
• Transfer Systems for Wafer; Reticles or FPD’s
• Wafer Identification; Marking
• Wet Station, SRD (Except Asher Etcher)